خلاصه: Discover the innovative Through-Glass Vias (TGV) technology for JGS1, JGS2, sapphire, and Corning glass, designed for sensor manufacturing and packaging. Enhance performance and reliability in automotive, aerospace, medical, and consumer electronics with our advanced TGV solutions.
ویژگیهای مرتبط با محصول:
Enables device miniaturization with compact interconnect solutions.
Supports anodic bonding with silicon wafers, eliminating out-gassing issues.
Superior high-frequency characteristics ideal for RF applications.
Precise via pitch tolerance of less than ±20μm per 200mm wafer.
قابل تطبیق برای وافرهایی تا 200 میلی متر قطر
Laser-induced etching ensures crack-free blind and through vias.
High aspect ratios and high-density vias for modern technology demands.
Widely used in high-performance computing, 5G, IoT, and sensor packaging.
سوالات:
What is Through Glass Via (TGV) technology?
TGV technology is a microfabrication technique for creating vertical electrical connections through glass substrates, essential for advanced electronic packaging and high-density integration.
کاربردهای TGV در نیمهرساناها چیست؟
در نیمه هادی ها، فناوری TGV برای ادغام چگالی بالا، عملکرد فرکانس بالا و بهبود ثبات حرارتی و مکانیکی در برنامه هایی مانند 5G، IoT و بسته بندی سنسور استفاده می شود.
What materials are compatible with TGV technology?
TGV technology is compatible with premium materials such as JGS1, JGS2, sapphire, and Corning glass, making it versatile for various high-performance applications.