سیستم تراش چند سیم الماس برای مواد شکننده سی سی / سفیر / فوق سخت

ویدیوهای دیگر
August 19, 2025
اتصال دسته بندی: تجهیزات آزمایشگاهی علمی
خلاصه: Discover the Multi-Wire Diamond Sawing System, designed for precision slicing of ultra-hard materials like SiC, sapphire, and GaN. This advanced machine boosts efficiency with high-throughput cutting, ensuring superior surface quality and dimensional accuracy for semiconductor, photovoltaic, and LED industries.
ویژگی‌های مرتبط با محصول:
  • High-throughput cutting with wire speeds up to 1500 m/min, enabling 50-200 slices per operation.
  • Precision control with ±0.005 mm positioning accuracy and closed-loop wire tension control.
  • Flexible modular design supporting wire diameters from 0.12-0.45 mm for various cutting stages.
  • Industrial durability with a rigid machine frame and ceramic-coated guide wheels for >8000 hours of service life.
  • Intelligent control system with real-time monitoring, recipe storage, and remote monitoring functions.
  • High-pressure cooling and multi-stage filtration for effective debris removal and thermal management.
  • Wide application range including semiconductors, photovoltaics, LED, and advanced ceramics.
  • Max. work size of 220×200×350 mm for square and Φ205×350 mm for round workpieces.
سوالات:
  • سیستم اره الماسه چند سیمه چه موادی را می تواند برش دهد؟
    برای مواد فوق العاده سخت و شکننده مانند SiC، GaN، سفیر، کوارتز، سرامیک و سیلیکون مونو / پلی کریستال طراحی شده است، که به طور گسترده ای در نیمه هادی، فتوولتائیک، LED،و سرامیک های پیشرفته.
  • How does the Multi-Wire Diamond Sawing System compare to single-wire saws?
    It offers 5-10× higher throughput, cutting dozens to hundreds of wafers per cycle, with kerf loss <100 μm, increasing material utilization by 30-40%, while maintaining high precision (±0.02 mm) and excellent surface quality (Ra <0.5 μm).
  • What is the maximum processing capacity of the machine?
    The machine can handle square workpieces up to 220 × 200 × 350 mm and round workpieces up to Φ205 × 350 mm, with wire speeds up to 1500 m/min, producing 50-200 slices per run depending on material and wire diameter.